form8k-feb09.htm
UNITED
STATES
SECURITIES
AND EXCHANGE COMMISSION
Washington,
D.C. 20549
FORM
8-K
CURRENT
REPORT
Pursuant
to Section 13 OR 15(d) of The Securities Exchange Act of 1934
February
23, 2009
Date of
Report (date of earliest event reported)
MICRON
TECHNOLOGY, INC.
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(Exact
name of registrant as specified in its
charter)
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Delaware
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1-10658
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75-1618004
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(State
or other jurisdiction of incorporation)
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(Commission
File Number)
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(I.R.S.
Employer Identification No.)
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8000
South Federal Way
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Boise,
Idaho 83716-9632
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(Address
of principal executive offices)
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(208)
368-4000
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(Registrant’s
telephone number, including area code)
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Check the
appropriate box below if the Form 8-K filing is intended to simultaneously
satisfy the filing obligation of the registrant under any of the following
provisions (see General Instruction A.2. below):
o
Written communications pursuant to Rule 425 under the Securities Act (17 CFR
230.425)
o
Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR
240.14a-12)
o
Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act
(17 CFR 240.14d-2(b))
o
Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act
(17 CFR 240.13e-4c))
Item
2.05.
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Costs
Associated with Exit or Disposal
Activities.
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On
February 23, 2009, the Company announced that it will phase out 200mm wafer
manufacturing operations at its Boise, Idaho, facility. This action
will reduce employment at the Company’s Idaho sites by approximately 500
employees in the near term and by as many as 2,000 positions by the end of the
Company’s fiscal year.
In
connection with these activities, the Company will incur cash restructuring
charges of approximately $50 million, comprised primarily of severance and other
employee related costs. The Company expects to generate a gross
annualized operating cash benefit of $150 million in connection with the phase
out of its 200mm wafer manufacturing operations in Boise. The net
operating cash flow effect is expected to be neutral for fiscal
2009.
The full
text of the press release issued in connection with the Company’s announcement
is attached as Exhibit 99.1 to this Current Report on Form 8-K.
This
Current Report on Form 8-K contains forward-looking statements regarding future
employment levels restructuring charges, operating cash benefit and operating
cash. Actual events or results may differ materially from those
contained in the forward-looking statements. Please refer to the
documents the Company files on a consolidated basis from time to time with the
Securities and Exchange Commission, specifically the Company's most recent Form
10-K and Form 10-Q. These documents contain and identify important
factors that could cause the actual results for the Company on a consolidated
basis to differ materially from those contained in our forward-looking
statements (see Certain Factors). Although we believe that the
expectations reflected in the forward-looking statements are reasonable, we
cannot guarantee future results, levels of activity, performance or
achievements. We are under no duty to update any of the
forward-looking statements after the date of this report to conform to actual
results.
Item
9.01.
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Financial
Statements and Exhibits.
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(d) Exhibits.
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The
following exhibits are filed
herewith:
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Exhibit No.
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Description
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99.1
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Press
Release issued on February 23, 2009
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SIGNATURE
Pursuant
to the requirements of the Securities Exchange Act of 1934, the Registrant has
duly caused this report to be signed on its behalf by the undersigned hereunto
duly authorized.
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MICRON
TECHNOLOGY, INC.
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Date:
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February
23, 2009
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By:
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/s/
Ronald C. Foster
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Name:
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Ronald
C. Foster
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Title:
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Chief
Financial Officer and
Vice
President of Finance
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INDEX
TO EXHIBITS FILED WITH
THE
CURRENT REPORT ON FORM 8-K DATED FEBRUARY 23, 2009
Exhibit
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Description
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99.1
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Press
Release issued on February 23, 2009
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4
exhibit99-1.htm
EXHIBIT 99.1
FOR
IMMEDIATE RELEASE
Contacts:
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Kipp
A. Bedard
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Daniel
Francisco
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Investor
Relations
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Media
Relations
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kbedard@micron.com
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dfrancisco@micron.com
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(208)
368-4465
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(208)
368-5584
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MICRON
TECHNOLOGY RESPONDS TO CONTINUED DECREASES IN DEMAND
BOISE, Idaho, Feb. 23, 2009 –
Deteriorating economic conditions and decreased demand for 200 millimeter (mm)
specialty DRAM products have created additional challenges for Micron
Technology, Inc.’s Boise manufacturing operations. As a result, Micron announced
today that it will phase out 200mm wafer manufacturing operations at the
company’s Boise facility. This action will reduce employment at Micron’s Idaho
sites by approximately 500 employees in the near term and as many as 2,000
positions by the end of the company’s fiscal year. The company has sufficient
manufacturing capacity remaining and does not expect any disruption in product
supply required for customer needs.
“We remained hopeful that the demand
for these products would stabilize in the marketplace and start to improve as we
moved into the spring. Unfortunately, a better environment has not materialized,
and we are at a point where we wanted to let our employees and the community
know in advance what will occur later this summer,” said Steve Appleton, Micron
Chairman and CEO.
The company will continue to operate
its 300mm research and development fabrication facility at the Boise site and
perform a variety of other activities, including reticle manufacturing, product
design and support, quality assurance, systems integration and related
manufacturing, corporate and general services. These workforce changes were not
anticipated or included in Micron’s earlier 15 percent global workforce
reduction announcement last October. Following these changes, Micron will employ
more than 5,000 in the state.
Cash restructuring charges will be
approximately $50 million, which will generate a gross annualized operating cash
benefit of $150 million. The net operating cash flow effect will be neutral for
fiscal year 2009.
Micron is committed to assisting
employees affected by the workforce reductions and is providing severance and
outplacement services.
About
Micron
Micron Technology, Inc., is one of the
world's leading providers of advanced semiconductor solutions. Through its
worldwide operations, Micron manufactures and markets DRAM, NAND flash memory,
CMOS image sensors, other semiconductor components, and memory modules for use
in leading-edge computing, consumer, networking, and mobile products. Micron's
common stock is traded on the New York Stock Exchange (NYSE) under the MU
symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
###
Micron
and the Micron orbit logo are trademarks of Micron Technology, Inc. All other
trademarks are the property of their respective owners.
This
press release contains forward-looking statements regarding reductions in DRAM
production levels, the number of employees affected by the restructuring of the
Company’s memory operations, cash restructuring charges and other related
expenses and the cash operating margin benefit. Actual events or results may
differ materially from those contained in the forward-looking statements. Please
refer to the documents the Company files on a consolidated basis from time to
time with the Securities and Exchange Commission, specifically the Company's
most recent Form 10-K and Form 10-Q. These documents contain and identify
important factors that could cause the actual results for the Company on a
consolidated basis to differ materially from those contained in our
forward-looking statements (see Certain Factors). Although we believe that the
expectations reflected in the forward-looking statements are reasonable, we
cannot guarantee future results, levels of activity, performance or
achievements. We are under no duty to update any of the forward-looking
statements after the date of this report to conform to actual
results.